As artificial intelligence (AI) continues to advance, the demand for computing systems with higher performance, greater density, improved energy efficiency, and scalability grows ever stronger. Meeting these demands requires continuous innovation across the semiconductor landscape.
This presentation explores key breakthroughs in materials engineering, device architecture, and 3D and heterogeneous integration technologies that enable faster processing, lower power consumption, and enhanced system reliability.
Bich-Yen Nguyen,
Soitec
Together, these advancements are redefining the limits of semiconductor technology and powering the next generation of AI performance.
Bich-Yen Nguyen is a Senior Fellow at Soitec, where she has led the development of advanced Digital and RF SOI devices and applications, including 2.5D/3D stacking using SmartCutTM technology. The RF and FD-SOI platforms she helped advance are widely adopted in wireless/5G, AIoT, and automotive systems. Before joining Soitec, she was a Senior Manager and Dan Noble Fellow at Freescale/Motorola, contributing to the development and high-volume production of advanced CMOS and materials technologies. Her innovations and patents have generated over $1 billion in revenue. Bich-Yen is an IEEE Fellow and recipient of the IEEE Frederik Philips Award (2024), among numerous honors recognizing her leadership in SOI research and commercialization. She holds 200+ patents and has authored over 350 papers on IC processes, integration, and device technologies.