Packaging, integration, architecture, and circuits are required with the explosion of new computing paradigms and technological advancements. We will cover the relentless push for Moore’s Law with current and future transistor technologies like Fin-FET and gate-all-around. We will cover different packaging technologies that enable high-performance computing solutions like the ones integrated into the AuroraExascale Supercomputer.
Circuit innovations are also needed to extract performance from the fundamental technology. We will explore near-memory computing solutions, security circuits for confidential, fault-free operation, and adaptive circuits for reliability and resiliency.
Carlos Tokunaga is a principal engineer at Intel Corporation. He leads the Reliability and Resiliency Circuit Technology Group at the Circuit Research Lab. Carlos received a B.S. degree in electronics engineering from the University of Los Andes, Bogotá, Colombia, in 2001 and an M.S. and Ph.D. in electrical engineering from the University of Michigan in 2005 and 2008 respectively.
He is an IEEE Senior Member and serves as a member-at-large in the IEEE SSCS Adcom. He is the Circuit Short Course Chair for the VLSI Symposium and the TPC Co-Chair for CICC. He has published over 50 technical papers in refereed conferences and journals, comprising 12 JSSC, 10 ISSCC, 5 VLSI Symposiums, and 2 IEDM among others.