Engineers have been integrating dissimilar materials for semiconductor-based products since the invention of the integrated circuit. The increased demand for advanced product functionality at lower costs necessitates the exploration of heterogeneous integration techniques to meet these challenging metrics. This seminar will review various heterogeneous integration approaches for microelectronics that rely on compound semiconductors. Key topics will include hybrid wafer bonding and micro-transfer printing.
Andrew Carter,
Northrop Grumman Microelectronics Center
Andrew Carter is the Process Technology Section Manager at Space Park Foundry, Northrop Grumman Microelectronics Center (Manhattan Beach, CA). He holds a B.S. from the University of Notre Dame, as well as an M.S. and Ph.D. from UC Santa Barbara, all in Electrical Engineering. With over 20 years of experience in microelectronics fabrication, Andrew specializes in process flow development, process tool characterization and optimization, device analysis, and mask design.